Deep sub-micron technologies become unavoidable even for critical applications in fields like automotive or nuclear industry. This evolution may have an important impact on the reliability of electronic systems involved in such applications in the absence of pro-active mitigation approaches. This work will be mainly focused on the influence of thermal aspects, e.g. hightemperature and thermal cycles, on the reliability of CMOS circuits. Monitoring solutions should be defined at PCB and/or FPGA levels. These solutions should have limited interference with the mission logic. Three phases will be considered: · Study of the state-of-the-art concerning the thermal effects in CMOS circuits and the proposed monitoring solutions. The use of magneto-resistive structures for non-intrusive measurements of electrical current deviations should be considered. · Definition of new monitoring solutions for at least one of the thermal effects identified during the first phase. An evaluation by simulation of the efficiency of these monitoring solutions should be provided as well. · Experimental evaluation of at least one of the proposed solutions implemented on FPGA and, if possible, on PCB. The work should be concluded by a final report.

This position is open until it is filled.

Département: Département Architectures Conception et Logiciels Embarqués (LIST-LETI)
Laboratory: Laboratoire De Fiabilisation des Systèmes Embarqués
Start Date: 01-05-2015
ECA Code: PsD-DRT-15-0028
Contact: valentin.gherman<στο>cea.fr