Microelectronic extends its range of applications via the micro-systems comprising sensors, energy scavengers, high performance communication and low consumption modules. Thus, encapsulation and functional hermetic lid manufacturing are becoming more and more relevant. Indeed, metallic and polymer additive manufacturing (3D printing) allows more and more complex and heterogeneous design building and guaranty a good versatility and low costs. After recent machine investment at CEA-LETI and LITEN, it becomes possible to study the 3D printing encapsulation of a large variety and complex micro-systems.

The thesis objective is to improve the understanding of mecanisms involved during the 3D printing project (polymer, metal). Moreover, the adhesion issues on different substrates will be studied. Finally, the MEMS Microsystems packaging will be the central theme.

This position is open until it is filled.

Department: Département Composants Silicium (LETI)
Laboratory: Laboratoire Hétérogène
Start Date: 01-10-2015
ECA Code: SL-DRT-15-0771
Contact: baptiste.goubault<στο>cea.fr