Deep sub-micron technologies become unavoidable even for critical applications in fields like automotive or nuclear industry. This evolution may have an important impact on the reliability of electronic systems involved in such applications in the absence of pro-active mitigation approaches.

This thesis will be mainly focused on the influence of thermal aspects, e.g. high-temperature and thermal cycles, on the reliability of CMOS circuits. Monitoring solutions should be defined for electronic systems implemented on PCB and/or FPGA. These solutions and should enable on-line monitoring and have limited interference with the mission circuitry.

Required background:

– Microelectronics

– Spice

– VHDL and/or Verilog

– FPGA prototyping

This position is open until it is filled.

Department: Département Architectures Conception et Logiciels Embarqués (LIST-LETI)
Laboratory: Laboratoire De Fiabilisation des Systèmes Embarqués
Start Date: 01-09-2015
ECA Code: SL-DRT-15-0083
Contact: valentin.gherman<στο>cea.fr